Throughput vs. Distance Tradeoffs and Deployment Considerations for a Multi-Hop IEEE 802.16e Railroad Test Bed

mhempel2's photo
By Michael Hempel Tue, 01/30/2018 - 11:00

Publication Type:

Conference Paper

Authors:

Wei Wang; Sharif, Hamid; Hempel, Michael; Zhou, Ting; Mahasukhon, Puttipong

Source:

IEEE Vehicular Technology Conference (VTC-Spring), p.1-5 (2008)